Non-contact tweezers T-type
Tweezers that grasp wafers non-contactly by manual operation.
The wafer is grasped and transported non-contact through manual operation. There are no scratches, dirt, or damage.
- Company：ソーラーリサーチ研究所 大阪事業所
- Price：Other
Non-contact transport device - List of Manufacturers, Suppliers, Companies and Products
Non-contact transport device Product List
1～15 item / All 19 items
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SRL Float Chuck Type PF
Non-contact gripping of preform lenses, and loading and unloading into the press mold.
The "SRL Float Chuck PF Type" preform lens transfer device is a system that retrieves preform lenses from a press machine in a completely non-contact manner during the press molding process. By ejecting air, it generates negative pressure through the ejector effect and Bernoulli effect, as well as positive pressure through the pressure chamber type air cushion effect and the airflow cushion effect, allowing the lens to be suspended and transported in a non-contact state while floating in the air. This non-contact loading and unloading device for preform lenses, "SRL Float Chuck PF Type," does not come into contact with the lens surface or the lens edge. As a result, it does not scratch or dirty the lens surface and side edges, and it also prevents dust generation.
- Company：ソーラーリサーチ研究所 大阪事業所
- Price：Other
Solar cell and solar wafer non-contact transport device
Solar cell and solar wafer non-contact transport device
The solar cell solar wafers, silicon solar cells, amorphous solar cells, and thin-film solar cell cells are transported non-contact by blowing gas or air. A nozzle is equipped to ensure that the high-speed airflow emitted does not directly collide with the solar cells, and the mechanism prevents damage to the thin, fragile solar cells due to the high-speed airflow. Additionally, the "non-contact transport device for solar cell wafers" uses a small amount of air and is efficient. Furthermore, its structure does not discharge exhaust flow into the surrounding environment, thus preventing pollution.
- Company：ソーラーリサーチ研究所 大阪事業所
- Price：Other
Cleanroom-compatible "Bernoulli Chuck WAS Type"
Clean room compatible Bernoulli chuck that does not scatter debris.
The cleanroom-compatible "Bernoulli Chuck WAS type" efficiently suspends and transports workpieces in a non-contact state by ejecting gas. The "Bernoulli Chuck WAS type" is equipped with an exhaust recovery mechanism that captures the exhaust emitted from the nozzle, preventing the exhaust from leaking into the cleanroom. Therefore, it can be used for non-contact transport of wafers, glass substrates, and other items within the cleanroom.
- Company：ソーラーリサーチ研究所 大阪事業所
- Price：100,000 yen-500,000 yen
50μm thick ultra-thin glass non-contact transport device LNAS type
Non-contact transport of ultra-thin glass substrates with a thickness of 50μm - Non-contact transport device "50μm Thick Ultra-Thin Glass Non-Contact Transport Device LNAS Type"
The non-contact suction mechanism of the "50μm thick ultra-thin glass non-contact transport device LNAS type" is equipped with a gas deflector directly below the air jet nozzle. The gas deflector redirects the high-pressure air flow ejected from the nozzle at a right angle, causing it to collide directly with the ultra-thin glass without damaging it. Therefore, as shown in the pressure distribution diagram, there is no localized stress applied to the ultra-thin glass by the high-pressure ejected air (it is in a negative pressure state). As a result, thin workpieces and fragile ultra-thin glass will not be damaged.
- Company：ソーラーリサーチ研究所 大阪事業所
- Price：5 million yen-10 million yen
Heat-resistant specification: Non-contact transport device "Float Chuck SAH type"
Bernoulli chuck for non-contact transfer of high-temperature workpieces.
This product is manufactured according to the usage environment temperature and chemical specifications. The quartz glass used in ultra-high temperature applications possesses numerous characteristics, such as high purity, resistance to heat and acid, and high mechanical strength. It has become possible to transport wafers non-contact in cleaning tanks, oxidation diffusion furnaces, etching devices, CVD devices, etc., in the semiconductor manufacturing process, as well as non-contact transport of glass molding lenses. Additionally, products are made to suit various environments, including aluminum, SUS, PEEK, and others. ◎ Features 1. Heat resistance up to 1000°C 2. Materials are selected based on the usage temperature environment. PTFE, PEEK, aluminum, SUS316, quartz, considering acidic, alkaline, and corrosive gases. ◎ Target Work 1. High-temperature wafers 2. Glass molded lenses and preforms 3. Compound semiconductor wafers 4. Glass substrates
- Company：ソーラーリサーチ研究所 大阪事業所
- Price：Other
Wafer chip, microlens, high-temperature wafer, non-contact transport device for micro-objects.
Bernoulli chuck for non-contact transport of wafer chips, high-temperature wafers, lenses, and micro-objects.
The Bernoulli Chuck "Non-contact Transport Device for Microscopic Objects" has adopted a new vertical gas jet method. The vertical gas jet method allows the gas flow ejected from the nozzle to create a vertical gas jet in the cushion chamber, reducing the friction loss of the gas flow within the cushion chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capability compared to conventional models. This results in improved holding stability, increased resistance to impact, and nearly halved gas consumption. The "Non-contact Transport Device for Microscopic Objects" suspends and transports the workpiece in a non-contact state, floating in the air by ejecting air towards the substrate.
- Company：ソーラーリサーチ研究所 大阪事業所
- Price：100,000 yen-500,000 yen
Concave/Convex Lens Universal Bernoulli Chuck Type W
Both convex and concave lenses are transported non-contact using the same Bernoulli chuck type W.
The non-contact transport device "Convex/Concave Lens Shared Bernoulli Chuck Type W" can maintain and transport items in a suspended state without contact by ejecting gas towards the lens. This is made possible by forming two types of curved surfaces, convex and concave lenses, on the operating surface opposing the lens (patent pending). When the gap between the operating surface and the lens is large, the gas ejection nozzle, cushion chamber, and the gap between the operating surface and the lens function as the nozzle, vacuum chamber, and diffuser of an ejector, respectively. As a result, a negative pressure is generated in the cushion chamber, pulling the lens closer. When the lens is drawn in and the gap with the operating surface decreases, the cushion chamber functions as a pressure chamber type air cushion (hovercraft), causing the pressure in the cushion chamber to rise sharply, which separates the lens. This maintains the lens in a non-contact suspended state in the air at a distance that automatically keeps the balanced pressure of the cushion chamber between the operating surface and the lens.
- Company：ソーラーリサーチ研究所 大阪事業所
- Price：Other
Non-contact transport device for heavy objects "Float Chuck SA-5C (SAN) type"
Bernoulli chuck capable of efficient non-contact transport even for heavy workloads.
The heavy object non-contact transport device (Float Chuck SA-5C(SAN) type) adopts a new gas vertical jet method. The gas vertical jet method allows the gas flow ejected from the nozzle to create a vertical gas jet in the cushion chamber, reducing friction loss of the gas flow within the cushion chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capacity compared to conventional types. This results in improved holding stability, greater resistance to impact, and nearly halved gas consumption. New method: Explanation of the gas vertical jet method. The heavy object non-contact transport device (Float Chuck SA-5C(SAN) type) technology allows for the suspension and transport of substrates in a non-contact state by ejecting air towards the substrate, keeping it floating in the air. It is designed to handle high loads while achieving low air consumption.
- Company：ソーラーリサーチ研究所 大阪事業所
- Price：Other
Ultra-thin wafer non-contact transport device
Transport ultra-thin wafers with a thickness of 20μm by bending, warping, and without damage in a non-contact manner.
TAIKO wafers, ultra-thin wafers with a thickness of 20μm, and compound semiconductor wafers can be suspended and transported non-contact without damage. It does not cause stress on the wafers. Wafers with warping can also be suspended and transported non-contact without damage. The air consumption is very low, making it economical.
- Company：ソーラーリサーチ研究所 大阪事業所
- Price：Other
Wafer chip non-contact transport device
Transporting micro wafer chips and micro lenses non-contact.
It is non-contact. It is possible to transport small workpieces non-contact. There are no scratches or dirt attached. There is no damage.
- Company：ソーラーリサーチ研究所 大阪事業所
- Price：100,000 yen-500,000 yen
10G glass substrate non-contact transport device
10G glass substrate non-contact transport device
A non-contact transport device that holds and conveys workpieces in a suspended manner by ejecting gas. It employs a new mechanism for the gas ejection system, with the air ejection outlet positioned at a small angle relative to the workpiece. There is no deceleration of airflow velocity caused by friction losses due to wall contact of the airflow. The amount of negative pressure generated increases, and the efficiency of load generation improves. Compared to conventional technology, the suspension capability has significantly increased, and gas consumption has nearly halved. Therefore, it is adopted for the non-contact transport of large workpieces with high loads, particularly for the eighth generation large glass substrates (2200mm x 2200mm) used in LCDs, which had previously been avoided due to air consumption issues.
- Company：ソーラーリサーチ研究所 大阪事業所
- Price：Other
Non-contact transfer device "Float Chuck WLNA Type"
Grip and transport FPC, through-hole boards, films, and breathable non-woven fabrics without causing damage.
It grips, chucks, and transports flexible materials such as film, amorphous solar cells, paper, green sheets, non-woven fabrics, breathable materials, foams, and soft bodies. By blowing air towards the workpiece, it generates negative pressure through the Bernoulli effect, allowing it to chuck, grip, transport, stack, and handle the workpiece in a non-contact state.
- Company：ソーラーリサーチ研究所 大阪事業所
- Price：Other
Non-contact transport device for compound semiconductor wafers "SAG (InP) type"
The compound semiconductor wafers (GaAs, InP, GaP) are supplied through gas operation, and the wafers are non-contact suctioned and detached at a specified position.
◎Features 1. Non-contact transport of wafers at high temperatures of 450°C is possible. 2. Non-contact transport of the following notched compound semiconductor wafers (GaAs, InP, GaP) is possible. - Φ2 to 4 inch wafers - Φ2 to 4 inch x 1/4 wafers - Φ2 to 4 inch x 1/2 wafers
- Company：ソーラーリサーチ研究所 大阪事業所
- Price：100,000 yen-500,000 yen
VGFS Non-contact Transport Device "Float Chuck SAC Type"
Adopting the gas vertical jet flow method (VGFS), the Bernoulli chuck "Float Chuck SAC type" series reduces friction loss in the gas flow.
The "Float Chuck SAC Type" series, which adopts the gas vertical jet flow system (VGFS) and reduces friction loss in the gas flow, has newly implemented this gas vertical jet flow method. The gas vertical jet flow method vertically jets the gas flow ejected from the nozzle into the cushion chamber, reducing friction loss in the gas flow within the cushion chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capacity compared to conventional types. This results in improved holding stability, increased resistance to impact, and nearly halved gas consumption.
- Company：ソーラーリサーチ研究所 大阪事業所
- Price：Other
